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2009, vol. 18, br. 3, str. 1-4
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Karakterizacija nekih bezolovnih lemnih legura na bazi kalaja i indijuma
Characterization of some lead-free solder alloys based on tin and indium
aInstitut za rudarstvo i metalurgiju, Bor, Srbija
bUniverzitet u Beogradu, Tehnički fakultet u Boru, Srbija
cUniverzitet u Prištini sa privremenim sedištem u Kosovskoj Mitrovici, Fakultet tehničkih nauka, Srbija
dUniverzitet u Beogradu, Srbija + Univerzitet u Beogradu, Institut za hemiju, tehnologiju i metalurgiju - IHTM, Srbija
Sažetak
Veliku primenu u industriji, a posebno elektronici imaju lemne legure na bazi kalaja i olova. Bez obzira na postojeće zakonske regulative koje ograničavaju sadržaj olova u elektronskim komponentama, ove legure se zbog svojih osobina i dalje koriste u praksi. Iz tih razloga istraživanje bezolovnih lemnih legura aktuelno je i dalje. U ovom radu prikazani su rezultati ispitivanja bezolovnih lemnih legura na bazi kalaja i indijuma sa dodatkom srebra i bakra. Karakterizacija legura obuhvata rezultate diferencijalne skenirajuće kalorimetrije sa EDX, optičke mikroskopije, skening elektronske mikroskopije te merenja elektroprovodljivosti i mikrotvrdoće. Prikazani rezultati doprinose boljem poznavanju strukturnih osobina navedenih višekomponentnih bezolovnih lemnih legura na bazi kalaja i indijuma.
Abstract
Lead - tin solder alloys are standard solder alloys in industry, especially in electronics, due to their characteristics (low melting, wettability reliability, low cost, etc). Despite world directives about hazardous substances, these alloys are still used in electronics, and because of that investigations are still going in way to find appropriate lead - free solder alloy. In this paper characterization of some lead-free solder alloys based on tin and indium, and with addition of silver and copper, are investigated. Characteristic temperatures for each alloy are obtained by DSC measurements microstructure and distribution of phases, by optical microscopy and SEM-EDX. Electrical conductivity and microhardness measured values are presented also. Considering practical usage of these alloys in industry, the composition of tin in all investigated alloys is > 50%. These results are given in order to contribute the knowledge about lead-free solders, especially tin and indium based solder alloys, which are potential candidates for replacement standard lead - tin solders.
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