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2004, vol. 49, br. 2, str. 61-65
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Uticaj reparature na nivo i raspodelu zaostalih napona u sučeonom zavarenom spoju mikrolegiranog čelika
The effect of repair welding on the level and the distribution of residual stresses in a micro alloyed steel butt-weld
Univerza v Mariboru, Fakulteta za strojništvo, Laboratorij za varjenje Smetanova, Maribor, Slovenija
Sažetak
Kod izrade zavarenih spojeva pojavljuju se zaostali naponi koji mogu dostići napon tečenja materijala. Oni su posledica termičkog uticaja zavarivanja topljenjem materijala. Šav pri reparaturi je uklješten, jer se obično radi o kratkim zavarima, koji obuhvataju samo jedan deo debljine. Zbog toga su zaostali naponi na reparaturama viši od napona u normalnim šavovima. U radu su eksprimentalno određivani zaostali naponi na površini sučeonih višeprolaznih šavova pre i posle reparaturnog zavarivanja. Najveće uzdužne komponente napona su u metalu šava. Ti naponi su blizu napona tečenja materijala. Poprečne komponete napona su manje od uzdužnih. Posle reparature izmereni su veći zaostali naponi od onih pre reparature.
Abstract
High residual stresses arise during welding. These stresses can attain yield strength of the material. They are caused by thermal cycles always present in joints made by fusion of materials. When a weld needs to be repaired, it is very rigid because repair welds are usually short and only a part of thickness should be replaced. Residual stresses in the repaired welds are higher than those in normal welds. Residual stresses were experimentally determined on surface of the multi-pass butt-welds before and after reparation. Longitudinal residual stresses are the highest in the weld metal. They approach the yield strength of the material. Transversal residual stresses are lover than longitudinal ones. The residual stresses are higher after reparation than before reparation.
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Reference
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*** Annual book of ASTM standards: Standard test method for determination residual stress by the hole-drilling strain gage method. Philadelphia, PA: American Society for Testing and Materials, E 837, Section 3 volume 03. 01
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